Advanced heat pipe solution with high heat transfer coefficients for boiling & condensation
Heat pipe is a heat-transfer device that employs phase transition, boiling & condensation process to transfer heat between two solid interfaces. With high heat transfer coefficients for boiling and condensation, heat pipe is extraordinarily effective thermal conductors. By bending and wiring heat pipes into heatsink, the heat source from chips can be carried out upward to higher local location of fin array with uniform temperature field, which benefits the enhancement of air-blowing cooling efficiency. Delta has profound design knowledge and experienced simulation techniques that help to pursue the most efficient heat pipe cooling solution.
Remote heat pipe module (EVAC) for enhanced volume air cooling solution
Compared to moderate conductive improvements such as changes on heat pipe design or layout, increasing overall heat-transfer volume is a remarkably effective path in pursuit of enhancement because heatsink volume is the deciding factor to cooling performance. In order to reduce temperature on chips, Delta has accomplished the volume enhancement by extending heat pipe out to a remote end in order to achieve cooling performance improvement. Delta keeps exploring the potential of volume enhancement by extending heat pipe out to a remote end in order to achieve cooling performance improvement to the next level.