Bruce Cheng, Delta Founder and Honorary Chairman, Yancey Hai, Chairman, Vincent Lin, Head of Advanced Manufacturing Business Unit, Industrial Automation Business Group, Glenn Farris, Vice President of Universal Instruments attended SEMICON Taiwan 2023.
Glenn Farris explained different IC packaging methods to Bruce Cheng and Yancey Hai.
During the exhibition, the booth was crowded with visitors and media groups coming to view the smart solutions developed by Delta and Universal Instruments.
Delta demonstrated Wafer Grinding and Inspection Solutions that included a Wafer Edge Grinding Machine, Wafer Edge Profile Measurement Machine, Wafer Sorter, and IR Pinhole Inspection Machine.
For semiconductor packaging, Delta and Universal Instruments showcased High-Speed, Multi-Die Advanced Packaging equipment, which caught the eyes of visitors curious to learn more about it.
