12/10/2025
Delta’s DIATwin Empowers MPI to Deliver Cyber-Physical Integration for Semiconductor Equipment Development
In semiconductor equipment manufacturing, systems are highly customized and complex, which brings challenges for machine validation and performance optimization before physical deployment. As a result, deploying digitization has become critical to gaining a competitive edge in efficiency and innovation. Cyber-physical integration enabled by digital twin is considered key to shortening development cycles, and strengthening productivity.
MPI Corporation, a leading semiconductor equipment manufacturer, has been developing the SIRIUS software development & integration platform to support value-added applications, including cyber-physical integration. During its initial adoption of digital twin technology, MPI faced several challenges:
- Collision Detection: Difficulties establishing accurate virtual collision detection increased safety and cost risks when deployed to physical equipment.
- Complex Modeling Workflows: Traditional equipment modeling was not intuitive enough to support frequent customization.
- Motion Model Accuracy: The lack of high-precision trajectory simulations could lead to wafer damage or equipment errors.
To address the pain points, MPI adopted Delta’s DIATwin Virtual Machine Development Platform into the SIRIUS platform. The collaboration enables features including built-in collision detection and API integration of virtual devices with existing systems. Along with DIATwin’s standardized modeling and trajectory simulation that accurately align with physical performance, SIRIUS streamlines equipment development with powerful cyber-physical integration.
Delta’s DIATwin offers the following benefits:
- Shorter Development Cycles: Virtual simulation speeds up the cycle from design, NPI, to mass production.
- Lower Trial-and-Error Costs: Collision detection and simulation reduce physical operation errors and maintenance costs.
- Enhanced System Integration: API facilitates the integration of virtual and physical machines to streamline the development process.
Results and Outlook
DIATwin empowers MPI to strengthen its cyber-physical integration capabilities with accurate collision detection and motion simulation, and intuitive modeling. The collaboration enhances efficiency and precision right from the development phase while optimizing the machine’s total cost of ownership, driving semiconductor smart manufacturing forward.