In precision manufacturing, products are becoming increasingly miniaturized and complex. During the production and R&D of components such as passive components, IC chips, high-precision parts, and compact PCB assemblies, it is essential to analyze internal structures with nano- or submicron-level resolution without damaging the sample to ensure the detection of potential defects. However, conventional optical inspection often falls short of meeting these demands.
Traditional methods for inspecting internal structure and defect analysis typically require damaging the sample to observe its interior. This not only raises costs but also destroys the defect area itself, making root cause analysis impossible. Moreover, traditional equipment is often complicated and time-consuming, requiring experts to manually adjust parameters for long periods. From sample preparation to result analysis, the process can be lengthy and inefficient. To address these pain points, Delta has introduced the DELInspect Desktop 3D Computed Tomography Scanner Series, delivering precise, efficient, and safe inspection solutions. Leveraging the non-destructive and high-penetration capabilities of X-ray technology, combined with comprehensive radiation protection, DELInspect can accurately identify hidden defects inside components without damaging the product.
The DELInspect Series supports a wide range of inspection applications. It can identify BGA voids in PCBA, solder joint defects, and multi-layer structure issues. In wire-wound inductors, it can inspect coil winding integrity and solder connections. Among the series, the DELInspect new model achieves nanometer-level imaging (down to 0.5 μm voxel resolution), leaving no hidden defects undetected. The "one-click smart scanning" feature also simplifies operation by providing users with recommended scanning parameters, reducing trial-and-error costs. The entire series features built-in radiation protection, eliminating the need for the shielding room. This improves inspection accuracy and efficiency while ensuring operational safety.
Benefits of adopting Delta's DELInspect Desktop 3D Computed Tomography Scanners, include:
Non-destructive scanning, reducing costs and risks
Without disassembling or destroying the sample, the DELInspect Series enables volumetric visualization of internal structures. For high-value, high-precision electronic components, this allows more accurate defect analysis and process optimization, significantly reducing the costs and risks of sample damage.
High-resolution and high-quality imaging, detecting tiny defects accurately
The DELInspect Series provides high-quality micro- and nano-level imaging, capable of inspecting defects in fine structures such as cracks, solder voids, and internal IC metal wiring, greatly enhancing product yield and reliability.
Safe, high-performance operation with a small footprint, reducing labor costs
Built-in radiation shielding and interlocks, which are compliant with international standards, protect operators' health and safety. No additional shielding room or restricted area is required, reducing facility build-out costs. The compact desktop design offers flexibility for diverse workspaces. Versatile sample carriers for different sizes, along with automated field-of-view selection and object size detection, accelerate workflows and improve efficiency.
Delta’s DELInspect Desktop 3D Computed Tomography Scanner Series utilizes X-ray technology, high-resolution imaging, and smart, convenient operation features to provide the electronics industry with an efficient, accurate, and safe non-destructive testing solution, accelerating product development while ensuring quality, empowering modern manufacturing on the path toward smart production.
Caption: Solder void detection for PCBAs
Learn more: DELInspect Desktop 3D Computed Tomography Scanner