Delta and Subsidiary Universal Instruments Demonstrate Smart Solutions for Semiconductor Manufacturing at SEMICON Taiwan 2023

Delta and its U.S.-based subsidiary Universal Instruments jointly participated for the first time at the SEMICON Taiwan 2023 exhibition, an annual event which came to a close on September 8^th. The companies unveiled comprehensive Wafer Grinding and Inspection Solutions as well as High-Speed, Multi-Die Advanced Packaging equipment that help the semiconductor industry optimize both front- and back-end manufacturing processes. During the exhibition, the booth was crowded with visitors and media groups that came to view the smart solutions developed by Delta and Universal Instruments.

Andy Liu, general manager of Delta’s Industrial Automation Business Group (IABG), stated, “The semiconductor industry is the main driver of Taiwan’s economic growth and has made Taiwan a pillar of the global supply chain. In the post-pandemic era, with chip demand soaring, semiconductor manufacturers are facing a significant shortage of tech workers that has resulted in weak productivity. To address these challenges, Delta and Universal Instruments are combining their superior capabilities to deliver smart, high-precision and high-speed solutions to fulfill the diverse demands of our semiconductor customers while guiding the entire semiconductor industry far into the smart manufacturing future.”

During the three-day showcase at SEMICON Taiwan 2023, Delta presented Wafer Grinding and Inspection Solutions for the semiconductor front-end process, including Wafer Edge Grinding Machine, Wafer Edge Profile Measurement Machine, Wafer Sorter, and IR Pinhole Inspection Machine to perform wafer grinding processing and edge/defect measurement. In addition, for the back-end process, Delta has leveraged Universal Instruments’ world-class technical prowess to display High-Speed, Multi-Die Advanced Packaging equipment which caught the eyes of visitors curious to learn more about its applications. The FuzionSC™ Platform supports the broadest range of feeding devices and can be coupled with Universal Instruments’ High-Speed Wafer Feeder (HSWF), which is suitable for various applications requiring advanced packaging technology.

With years of solid experience in the industrial automation field, Delta and Universal Instruments will continue to devote themselves to developing cutting-edge solutions and products, helping the semiconductor industry optimize the manufacturing process, establishing smart plants, and attaining smart manufacturing goals in the near future.