Integrating DIATwin, DIAEAP+, and DIASECS for pre-facility virtual testing. Shorten spec alignment, optimize yield, and enable real-time cyber-physical connectivity to accelerate production deployment.

High-speed AI inspection with flexible transfer and loading / unloading design for cleanroom requirements.

Integrated with EFEM for automated measurement of round and square silicon, SiC, and glass wafers, with customizable scan lines and parameter settings.

Dual grinding stations and quick-change grinding wheels enable simultaneous loading/unloading and grinding, improving throughput and equipment utilization.

Enables non-contact, non-destructive measurement of notch, flat, and edge shapes, with optional Edge AOI for chamfer quality and edge chipping inspection.

Integrates renewables, energy storage, and fuel cells, leveraging advanced control systems for dynamic dispatch. During grid fluctuations or accidents, it ensures continuous operations and protects critical processes from voltage sags, enhancing overall power resilience and operational reliability.

Advancing CPO manufacturing with precision alignment, assembly, and inspection for higher efficiency, process stability, and optical component quality.

Six-axis direct-drive stage and precision control enable fast fiber-array alignment, pose correction, and optimal optical coupling, with flexible integration into automated assembly systems.

Standardized control modules for advanced packaging and testing equipment, enabling micron-level positioning, bonding protection, thermal compensation, and improved throughput.