FuzionOF™ Platform

FuzionOF™ continues Universal’s lineage of implementing odd-form solutions on a standard surface mount platform, delivering unmatched performance for a diverse range of pin-in-paste odd-form, surface mount odd-form and standard surface mount applications.

FuzionOF™ features the highest available odd-form automation throughput to reduce cycle times and eliminate bottlenecks. It handles a full range of standard SMT and non-traditional components up to 150mm square and up to 40mm tall, with 5kg placement force. With the most complete range of component handling and input types, a wide variety of standard tooling, and custom design and implementation services, FuzionOF addresses virtually any odd-form application. It also incorporates precise, repeatable, closed-loop processes that reduce defects, rework and waste. FuzionOF transforms back-end assembly into a strategic advantage.

Datasheet

Product Introduction

Features & Benefits
  • Single-beam platform with throughput up to 16,500 cph
  • Full range of SM components to pin-in-paste and all odd parts in between
  • 0201 – 55mm square (SFoV) and 150mm square (MFoV)
  • Components up to 33mm tall, up to 5kg placement force
  • Adjustable gripper and full array of odd-form nozzles; broad tooling portfolio
  • Highest online capacity, widest range of feeder input types
  • Improve output and yields vs. manual assembly; accelerate ROI with rapid payback
Specifications
  • FuzionOF – Versatile IC placement platform perfect for special processes such as Pin-in-Paste, Flip Chip and OFA
FuzionOF
Throughput (cph) 16,500 (Max) / 11,400 (1-Bd IPC Chips)
Accuracy (µm) at greater than 1.00 Cpk ±38 (Chips) / ±27 (ICs)
Max Board Size 508 x 813mm
Max Feeder Inputs (8mm) 120 (2 ULC)
Component Range 0201 – 150mm sq, 25mm tall

Dimension